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| Characteristic |
Capability |
| Production Capacity |
1,000,000 sq.ft/Month |
| Layer(mass production) |
2 to 24 Layers |
| Max Panel Size |
450*660mm |
| Copper Clad Laminate |
FR4,FR4(Halogen free),FR5,CEM-1 ,CEM-3 , |
| PTFE,Rogers,Getek,BT,Polyimide, |
| Al Base,High-TG(TG>170 ℃ ) |
| Base Copper Thickness |
1/3 OZ --4 OZ |
| Impedance Control |
+/-8% |
| Board Thickness |
Min:6mil(0.15mm) |
| Max:280mil(7mm) |
| Minimum Thickness of CCL |
.5mil (0.0875mm) (Include Cu) |
| Blind/Buried hole |
YES |
| Drilling (Minimum size) |
Mechanical drilling |
8mil(0.2mm) |
| Laser drilling |
4mil(0.1mm) |
| Inner Etching |
Minimum line/Space(A/W) |
2.5mil(0.0625mm) |
| Line Width Tolerance |
+/-8% |
| Board Thickness(min) |
2.5mil(0.625mm) |
| Plating Hole |
Minimum Hole Size |
6mil (0.15mm) |
| Aspect Ratio (max) |
12:01 |
| Position Accurary |
+/-1.8mil(0.045mm) |
| Microvia |
Minimum Hole Size |
3mil(0.075mm) |
| Aspect Ratio (max) |
1:01 |
| Outer Etching |
Minimum Width /Space |
2.5mil(0.05mm) |
| Line Width Tolerance |
+/-0.4mil(0.01mm) |
| Solder Mask |
Bridge |
3.0mil(0.075mm) |
| Position Accurary |
1.5mil(0.0375mm) |
| Selective Gold Plating |
Gold Thickness |
100u ″ (2.5um) |
| Press |
Thickness Tolerance |
8% |
| Wrap/Twist |
0.70% |
| Inner Opening (min) |
(1) 4/L:5mil(0.125mm) |
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(2) 6/L-8/L:6mil(0.15mm) |
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(3) 8/L or above:8mil(0.2mm) |
| Surface Treatment |
Hot Air Leveling,Gold/Nickel Plating,Immersion Gold/Tin/Sliver,Gold Finger, Peeable mask,Carbon Ink,OSP(Entek,F2) |
| Test |
AOI Test,Flying-needle Test,Fixture Test |
| Lead Time |
sample mass production |
S/D L:3days;4-8L:5-15days |
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S/D L:5days;4-8L:10-25days |
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